Inline 3D Solder Paste Inspection (SPI)

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High Precision 3D SPI Inspection System for Inline Applications with Easy to use Software and fast 3D recognition in two different sizes 

  • High resolution Image Processing System

  • Programmable Spatial Light Modulation (PSLM) for ease of use and low wear

  • Phase Modulation Profilometry for lowest height resolution and best

  • repeatability

  • Diffuse Light System to eliminate shadow effects

  • For Solder Paste and Glue/SMD Adhesives 3D measurements

  • Teach-In or Gerber Data Import included

  • CAD data import included

  • Closed loop process control links for AOI and SMT Printers available

  • Two Inline models (for different PCB sizes)

 

High Precision Inline SPI Systems for Solder Paste and Glue Dot Inspection

 

Leimattenstrasse 6

8907  Wettswil

 Switzerland

T: +41 (0)41 752 00 32

 

info@lavortec.com

© Lavortec GmbH 2017-2019