SMD/BGA Rework

SMD/BGA Rework Systems

Various models from manual up to automatic BGA/SMD repair work are available. All systems are in daily use in the industry and ensure safe and precise repairs of PCB's.

ECOS550 Manual X and Y-axis adjustment, Automated Z-axis for removal, placement, soldering Laser Pointer for Centering, Single thermocouple input, Three temperature zones to heat up independently, equipped with touch panel interface and PLC control	PRO650 High-definition optical alignment system (50X) Manual X-and Y-axis, positioning, automated Z-axis for removal, placement, soldering Micrometer-adjust X-, Y-, and Ø-axis lead-to-pad alignmentl, three thermocouple inputs, equipped with touch panel interface and PLC controlling	PRO660 High-definition optical alignment system (50X) Manual X-and Y-axis optics positioning Automated Z-axis for removal, placement, soldering Micrometer-adjust X-, Y-, and Ø-axis lead-to-pad alignment Three thermocouple inputs Equipped with touch panel interface and PLC controlling
PRO880 all three axes (X/Y/Z) with linear rails for high accuracy, fine adjustment and perfect positioning PLC and touch screen based operation to store up to 100 different desoldering/soldering programs three temperature zones to heat up independently. Hot air convection to heat between up and down zones, IR heating system from the bottom. Precise temperature control (+1/-2°C). All 6 heating zones can be programmed individually. the upper heating head can automatically remove and lift off the BGA/SMA	Master1000 The industry’s most reliable and affordable solution for the widest range of SMT repairs. Safe Removal, High-Precision Placement, and Perfect Soldering for any SMD Repair Application Touch Screen/PLC control for all desoldering/soldering parameters Three independent heating zones Auto feed chips, pick up chips, blow off, autorecognition of chips High precison K-type closed loop system Optical alignement system with 15" high definition monitor